Best Equipment for advanced Dicing-Grinding Service

DISCO’s high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding machines, combined with AOI tools, offer customers the highest level of quality. Consumables like tapes, dicing blades and grinding wheels complete our full service. Using DISCO equipment,  the Dicing-Grinding Service processes customer products under optimal conditions. Below are all machines used by KKM Services in America.
*This is a partial machine list, please inquire for full updated list.

DAD3350

DAD3350

Automatic single spindle dicing

DFD6362

DFD6362

Fully automatic facing dual spindle dicing

DFD6363

DFD6363

Fully automatic dicing with frame/wafer handling and half/full cut abilities

DFL7160

DFL7160

Fully automatic ablation laser full cut and DAF

DFL7340

DFL7340

Fully automatic Stealth Dicing

DFL7341

DFL7341

Fully automatic Stealth Dicing

DFL7361

DFL7361

Fully automatic Stealth Dicing

DAG810

DAG810

Automatic single spindle grinder

DFG8540

DFG8540

Standard dual spindle grinder

DGP8761+DFM2800

DGP8761+DFM2800

Integrated mounting, back grinding and stress relief

DWR1720

DWR1720

Deionized wafer recycling unit

DWR1722

DWR1722

Deionized wafer recycling unit

OKK OEX-FD

OKK OEX-FD

Face-down expander

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