Polishing (Migaku) - Adding Strength and Value

Wafer backside polishing post grinding is a form of stress relief for ground (thin) wafers, which can offer high die strength and superior wafer surface condition.

dry polishing enhances the ground and rough suface after grinding to add die strength and quality

Dry Polish & CMP for Stress Relief

Dry polish and CMP processes achieve a mirror polish on the wafer backside and results in stronger wafers and die. Both methods remove the damage on the wafer backside from grinding.

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