Grinding (Kezuru) & Polishing (Migaku)

The push for thinner die continues unabated and the need for advanced thinning capabilities continues to drive our development. As wafers become extremely thin, wafer handling, warpage, and breakage become much bigger challenges. As a result, optimal grinding and polishing (when needed) parameters are critical to a high yield wafer thinning process.  

grind ultra thin, microns, griding and dicing with grinding wheel

Wafer Backgrind

DISCO’s fixed abrasive, dual step grinding process is able to achieve excellent thickness tolerances and the fine grind wheel can control surface roughness to a nanometer scale. Advanced wafer handling methods allow us to thin wafers to below 100um final thickness, in some cases much thinner than 100um.

grinding sections or parts for broken wafers to avoid complete loss of dies

Chip and Partial Wafer Grinding

Individual die as well as partial or broken wafers can be mounted to a frame and ground to target thicknesses so that they can still be diced and packaged.

ultrapoligrind and poligrind enhances surface quality

Poligrind

Poligrind wheels with super fine diamonds deliver high wafer strength and excellent backside surface finish. This technology means that post grind stress relief is not necessary, lowering costs significantly while also reducing the environmental impact.

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