Types of Pick and Place
Our high speed Die Sorting process can pick dies from dicing ring frames or grip rings.
Wafers can be up to 12 inches and dies can be placed into various carrier mediums such as waffle pack,
gel-pak, tape and reel or form a reconstructed wafer by placing onto tape and frame in rectangular or round form.
Dies can also be placed up side down when necessary with the Flip Chip unit (Flipper) capability.
Whether you require high volume production or single wafer prototype build, we have the die sorting solution for you.
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